"Semiconductor Processor"

Job Description - Part 1

Basic Job Description:

Perform any or all of the following functions in the manufacture of electronic semiconductors: load semiconductor material into furnace; saw formed ingots into segments; load individual segment into crystal growing chamber and monitor controls; locate crystal axis in ingot using x-ray equipment and saw ingots into wafers; clean, polish, and load wafers into series of special purpose furnaces, chemical baths, and equipment used to form circuitry and change conductive properties.

Part 1	Part 2	Part 3	Part 4	Part 5
Duties / Tasks	Activities	Skills	Abilities	Knowledge / Experience

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Job Duties and Tasks for: "Semiconductor Processor"

1) Maintain processing, production, and inspection information and reports.

2) Align photo mask pattern on photoresist layer, expose pattern to ultraviolet light, and develop pattern, using specialized equipment.

3) Attach ampoule to diffusion pump to remove air from ampoule, and seal ampoule, using blowtorch.

4) Calculate etching time based on thickness of material to be removed from wafers or crystals.

5) Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands.

6) Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.

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7) Load and unload equipment chambers and transport finished product to storage or to area for further processing.

8) Load semiconductor material into furnace.

9) Locate crystal axis of ingot, and draw orientation lines on ingot, using x-ray equipment, drill, and sanding machine.

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10) Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles.

11) Measure and weigh amounts of crystal growing materials, mix and grind materials, load materials into container, and monitor processing procedures to help identify crystal growing problems.

12) Monitor operation and adjust controls of processing machines and equipment to produce compositions with specific electronic properties, using computer terminals.

13) Mount crystal ingots or wafers on blocks or plastic laminate, using special mounting devices, to facilitate their positioning in the holding fixtures of sawing, drilling, grinding or sanding equipment.

14) Operate saw to cut remelt into sections of specified size or to cut ingots into wafers.

15) Place semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers.

16) Scribe or separate wafers into dice.

17) Set, adjust, and readjust computerized or mechanical equipment controls to regulate power level, temperature, vacuum, and rotation speed of furnace, according to crystal growing specifications.

18) Stamp, etch, or scribe identifying information on finished component according to specifications.

19) Study work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations.

20) Clean and maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area.

21) Connect reactor to computer, using hand tools and power tools.

22) Count, sort, and weigh processed items.

23) Inspect equipment for leaks, diagnose malfunctions, and request repairs.

24) Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures.